STMicro Bets Big on Panel-Level Packaging in France
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STMicroelectronics invests $60 million in its Tours, France plant to pioneer advanced Panel-Level Packaging for semiconductors, aiming to boost efficiency and keep manufacturing in Europe. This move comes amid company-wide cost-cutting and job cuts, sparking concerns despite government backing and the promise of a more competitive European chip industry. The pilot line is expected to be operational by Q3 2026. Hosted on Acast. See acast.com/privacy for more information.
